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© 2001 Wilco Corporation | All Rights Reserved
       
 
  Features:
• High Impedance
• Reduce high frequency noise interference
• Multilayer construction for high reliability
• Solder coated terminals for wave and reflow solder
• Superior termination bonding strength
   
  Applications:
• Noise suppression in communication devices
• EMI/RFI attenuation and suppressions
• Hand held/portable devices
   
  Notes:
• Operating Temp: -25° C to 85° C
• Storage Temp: -40° to 85° C
• Solderability: 90% terminal coverage. Preheat 120 +/- 20° C for 60 sec.
• Solder Temp: 230 +/- 5° C
• Flux Rosin: Dip Time 3 +/- 1 sec.
• Thermal Shock: Impedence shall be within +/- 20% of initial value when temp. is -25° C and 85° C for 30 min. each for 50 cycles.
 
Wilco Part Number

Impedance
Z (ohms)

 Test Frequency
(MHz)		 Tol. RDC Max
(ohms)		 Amps
(mA)		  
WMLB0603-300 30 100 25% 0.2 200
WMLB0603-600 60 100 25% 0.2 200
WMLB0603-101 100 100 25% 0.3 200
WMLB0603-151 150 100 25% 0.4 100
WMLB0603-301 300 100 25% 0.6 100
WMLB0603-601 600 100 25% 0.8 100
WMLB0603-102 1000 100 25% 1 100